The first is the Semiconductor Equipment Business Unit, which manufactures and sells equipment essential for semiconductor manufacturing, including tools for assembly and packaging, visual inspection, die bonding, and final testing. The equipment produced by this unit integrates advanced artificial intelligence visual inspection technologies and intelligent factory automation solutions, facilitating smart manufacturing. These innovations help clients enhance factory efficiency while improving the quality of manufacturing processes and meeting delivery time expectations. Additionally, this unit offers maintenance services, technical support for the machinery, and sales of related spare parts and components. With robust engineering and technical capabilities, the Semiconductor Equipment Business Unit (SEBU) designs and develops its proprietary series within engineering centres and production facilities in Malaysia, Korea, and China.

The Semiconductor Solution Business Unit (SSBU) is a newly established segment that positions the group across a broader spectrum of the semiconductor value chain through strategic business integration and synergy in technological development. Mi Technovation operates multiple engineering centres across Malaysia, Taiwan, Korea, and China, each dedicated to research and development programmes tailored to specific product areas. Strategically located near relevant customers, these centres enhance opportunities and effectiveness in existing and prospective technical collaborations, ensuring competitiveness in appropriate markets and meeting the diverse needs of a wide range of customers. The Penang Engineering Centre in Malaysia emphasises research and development of innovative artificial intelligence-enabled wafer-level advanced packaging and die sorting machines, as well as high-quality infrared inspection and automated optical inspection equipment. Meanwhile, the Gyeonggi Engineering Centre in Korea concentrates on high precision and laser bonding equipment within the high-performance computing segment, representing the next wave of capital expansion. The Suzhou Engineering Centre in China focuses on power testing and final testing equipment, which pertains to the rapidly growing field of silicon carbide substrates and insulated-gate bipolar transistor modules.

Lastly, the Semiconductor Material Business Unit (SMBU) houses its major engineering centre in Taiwan. Renowned for its strong innovation capabilities and leading technology in advanced micro solder balls, the Tainan Engineering Centre develops new alloys for advanced applications in mobility and wearables, high-performance computing, memory, automotive, and renewable energy segments. These engineering centres continue to play a crucial role in developing in-house production equipment, driving ongoing enhancements in manufacturing efficiency. In the 2023 fiscal year, Mi Technovation allocated RM3.8 million to research and development initiatives, marking a significant period of innovation and diversification for the group. The organisation maintains a balanced focus on research and development activities, considering its diverse products and services alongside its strategic objectives.

Within the Semiconductor Equipment Business Unit (SEBU), the successful implementation of the electromagnetic interference attach and detach platform, and the introduction of AI-powered product lines generated tangible sales revenue, demonstrating the effectiveness of the group’s diversified strategy and its commitment to advancing technological capabilities. The Semiconductor Material Business Unit achieved a significant milestone by pioneering environmentally friendly solder balls with lower carbon emissions. Ongoing research within this unit focuses on developing solder balls that exhibit high current density, superior temperature cycling performance, and enhanced electromigration performance for AI-enabled and wafer-level chip scale packaging products.

As of 31 December 2023, the group held 83 granted patents and utility models and 67 pending patents and utility models across all business units. This impressive portfolio undergirds the group’s dedication to innovation and technological advancement. Oh Kuang Eng, the group’s chief executive officer, graduated from the University of Malaya with a Bachelor of Engineering (Mechanical). He has over 27 years of experience in the semiconductor industry, erudition, and expertise in semiconductor automated equipment and process development. His leadership continues to guide the group towards achieving its strategic goals while fostering a culture of innovation.